Comment on noise-induced bistability in a Monte Carlo surface-reaction modelCONSIDINE, D; REDNER, S; TAKAYASU, H et al.Physical review letters. 1989, Vol 63, Num 26, issn 0031-9007, 2857Article

The effect of crystallization of the dispersion phase in emulsions on the rate of interfacial reactionsMIKHALEV, O. I; KARPOV, I. N; KAZAROVA, E. B et al.Chemical physics letters. 1989, Vol 164, Num 1, pp 96-100, issn 0009-2614, 5 p.Article

Effects upon interfacial reactions by electric currents of reversing directionsDU, Mei-Yau; CHEN, Chih-Ming; CHEN, Sinn-Wen et al.Materials chemistry and physics. 2003, Vol 82, Num 3, pp 818-825, issn 0254-0584, 8 p.Article

Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared HeatingSHIUE, R. K; WU, S. K; CHEN, F. Y et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 6, pp 1742-1746, issn 1073-5623, 5 p.Article

Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) CouplesCHAO, Yi-Hsiang; CHEN, Sinn-Wen; CHANG, Chih-Hong et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2008, Vol 39, Num 3, pp 477-489, issn 1073-5623, 13 p.Article

Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni JointsLI, C. C; CHUNG, C. K; SHIH, W. L et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2014, Vol 45, Num 5, pp 2343-2346, issn 1073-5623, 4 p.Article

Diffusion-limited reactive wetting : effect of interfacial reaction behind the advancing triple lineHODAJ, F; DEZELLUS, O; BARBIER, J. N et al.Journal of materials science. 2007, Vol 42, Num 19, pp 8071-8082, issn 0022-2461, 12 p.Article

Interfacial reactions in alumina/CuAgTi braze/CuNi systemVALETTE, Coralie; DEVISMES, Marie-Francoise; VOYTOVYCH, Rayisa et al.Scripta materialia. 2005, Vol 52, Num 1, pp 1-6, issn 1359-6462, 6 p.Article

Observations of the advancing δ-ferrite/γ-austenite/liquid interface during the peritectic reactionMCDONALD, N. J; SRIDHAR, S.Journal of materials science. 2005, Vol 40, Num 9-10, pp 2411-2416, issn 0022-2461, 6 p.Conference Paper

Formation of interfacial reaction products in SCS-6 SiC/Ti₂AlNb compositesYANG, Y. Q; ZHU, Y; MA, Z. J et al.Scripta materialia. 2004, Vol 51, Num 5, pp 385-389, issn 1359-6462, 5 p.Article

Analysis of the source of dynamic interfacial phenomena during reaction between metal droplets and slagRHAMDHANI, M. A; COLEY, K. S; BROOKS, G. A et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2005, Vol 36, Num 5, pp 591-604, issn 1073-5615, 14 p.Article

The Effectiveness of Surface Coatings on Preventing Interfacial Reaction During Ultrasonic Welding of Aluminum to MagnesiumPANTELI, Alexandria; ROBSON, Joseph D; CHEN, Ying-Chun et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2013, Vol 44, Num 13, pp 5773-5782, issn 1073-5623, 10 p.Article

Interfacial Reactions During Titanium Dissolution in Liquid Iron: A Combined Experimental and Modeling ApproachPANDELAERS, Lieven; VERHAEGHE, Frederik; BLANPAIN, Bart et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2009, Vol 40, Num 5, pp 676-684, issn 1073-5615, 9 p.Article

Microstructure and Interfacial Reactions During Active Metal Brazing of Stainless Steel to TitaniumLAIK, A; SHIRZADI, A. A; TEWARI, R et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2013, Vol 44, Num 5, pp 2212-2225, issn 1073-5623, 14 p.Article

Growth mechanism of Ni₃Sn₄ in a Sn/Ni liquid/solid interfacial reactionSHEN, J; CHAN, Y. C; LIU, S. Y et al.Acta materialia. 2009, Vol 57, Num 17, pp 5196-5206, issn 1359-6454, 11 p.Article

Dynamic wetting of graphite and SiC by ferrosilicon alloys and silicon at 1550°CYUNES RUBIO, Pedro J; HONG, Lang; SAHA-CHAUDHURY, N et al.ISIJ international. 2006, Vol 46, Num 11, pp 1577-1586, issn 0915-1559, 10 p.Article

Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal agingSHI, X. Q; KWAN, H. F; NAI, S. M. L et al.Journal of materials science. 2004, Vol 39, Num 3, pp 1095-1099, issn 0022-2461, 5 p.Article

Thermochemistry of contacts between silicon nitride ceramics and steelsOLIVEIRA, F. J; SILVA, R. F; VIEIRA, J. M et al.Acta materialia. 2000, Vol 48, Num 18-19, pp 4659-4665, issn 1359-6454Conference Paper

Comment on: Chemical reactivity of alkali-semiconductor interfaces: the case of K/GaAs(110) and K/Si(100) interfaces by M.C.G. Passeggi Jr. et alSIUDA, R.Surface science. 1998, Vol 395, Num 1, pp 10-11, issn 0039-6028Article

Cr/phthalimide system : XPS study of interfacial reactionsCHENITE, A; SELMANI, A.Surface science. 1994, Vol 301, Num 1-3, pp 197-202, issn 0039-6028Article

Fabrication of V₂O₃/C core―shell structured composite and VC nanobelts by the thermal treatment of VO₂/C compositeYIFU ZHANG; MEIJUAN FAN; LING HU et al.Applied surface science. 2012, Vol 258, Num 24, pp 9650-9655, issn 0169-4332, 6 p.Article

The crystallization behavior and interfacial reaction of Ge₂Sb₂Te₅ thin films between dielectric material for the application to the phase change memoryJUNG, E. J; KANG, S. K; MIN, B. G et al.Proceedings - Electrochemical Society. 2003, pp 159-160, issn 0161-6374, isbn 1-56677-376-8, 2 p.Conference Paper

Interface physical chemistry of enamels (part 2) : Influence of cobalt and nickel on generation of the bubbles during enamel reactionSHIRASAKI, M; SHIMIZU, T; JIANG, Z et al.Nippon seramikkusu kyokai gakujutsu ronbunshi. 1998, Vol 106, Num 6, pp 570-575, issn 0914-5400Article

Study of processes which take place in the metal-coating contact layerZUBEKHIN, A. P; YATSENKO, E. A; GURNOVICH, N. V et al.Glass and ceramics. 1994, Vol 51, Num 1-2, pp 39-41, issn 0361-7610Article

Ceramic-metal reactions in composites, ceramic joining, and electronic packagingLOEHMAN, R. E.Scripta metallurgica et materialia. 1994, Vol 31, Num 8, pp 965-970, issn 0956-716XConference Paper